Izinhlelo zokusebenza ezijwayelekile:
Ukuhlolwa kwe-semiconductor- Ukuhlolwa kwe-wafer yangemuva, ukulinganiswa kwe-TSV (ngokusebenzisa i-silicon), ukubuyekezwa kwesici ngemva kokusika nge-laser
Ukuhlaziywa kokwehluleka– Ukuthwebula izithombe okungonakalisi ngokusebenzisa izisekelo ze-silicon ukuhlola izakhiwo ezigqitshiwe
Ukucutshungulwa kwe-laser- Ukuqashelwa kwesikhathi sangempela kwe-1064 nm fiber laser ablation, ukubhoboza, noma ukushisela kwisayensi yezinto zokwakha kanye nokukhiqiza
Isayensi yezinsimbi kanye nezinto zokwakha– Ukuhlolwa okuphezulu kwezindawo ezithinteke ngokushisa nge-laser, izendlalelo ezilungisiwe kabusha, kanye nezakhiwo ezincane
I-NIR fluorescence microscopy– Amasampula ezinto eziphilayo noma izinto ezidinga ukucasuka okuseduze kwe-infrared